cystech electronics corp. spec. no. : c781g6 issued date : 2011.06.10 revised date : page no. : 1/6 MTN3434G6 cystek product specification bv dss 30v n-channel enhancement mode power mosfet MTN3434G6 i d 6.1a r dson 34m description the MTN3434G6 is a n-channel enhancement-mode mosfet, providing the designer with the best combination of fast switching, ruggedized device de sign, low on-resistance and cost effectiveness. the tsop-6 package is universally preferred for a ll commercial-industrial surface mount applications. features equivalent circuit ? simple drive requirement MTN3434G6 ? low on-resistance ? capable of 2.5v gate drive ? pb-free lead plating package g gate s source d drain absolute maximum ratings (ta=25 c) parameter symbol limits unit drain-source voltage v ds 30 v gate-source voltage v gs 12 v continuous drain current @v gs =4.5v, t a =25 c (note 1) i d 6.1 a continuous drain current @v gs =4.5v, t a =70 c (note 1) i d 4.9 a pulsed drain current (note 2, 3) i dm 30 a p d 1.14 w total power dissipation @ t a =25 c linear derating factor 0.01 w / c operating junction and storage temp erature range tj ; tstg -55~+150 c thermal resistance, junction-to-ambient (note 1) rth,ja 110 c/w note : 1.surface mounted on 1 in2 copper pad of fr-4 board, t 5s. 180 /w when mounted on minimum copper pad. 2.pulse width lim ited by maximum junc tion temperature. 3.pulse width 300 s, duty cycle 2%
cystech electronics corp. spec. no. : c781g6 issued date : 2011.06.10 revised date : page no. : 2/6 MTN3434G6 cystek product specification electrical characteristics (tj=25 c, unless otherwise noted) symbol min. typ. max. unit test conditions static bv dss 30 - - v v gs =0v, i d =250 a v gs(th) 0.6 - - v v ds =v gs , i d =1ma i gss - - 100 na v gs =12v, v ds =0v - - 1 a v ds =30v, v gs =0v i dss - - 5 a v ds =24v, v gs =0v, tj=70 - - 34 i d =6.1a, v gs =4.5v *r ds(on) - - 50 m i d =2a, v gs =2.5v *g fs - 20 - s v ds =10v, i d =6.1a dynamic t d(on) - 21 - ns t r - 45 - ns t d(off) - 40 - ns t f - 30 - ns v ds =15v, i d =1a, v gs =4.5v, r g =6 ? , r d =15 ? qg - 8 12 nc qgs - 1.9 - nc qgd - 2.6 - nc v ds =15v, i d =6.1a, v gs =4.5v *pulse test : pulse width 300 s, duty cycle 2% source drain diode symbol min. typ. max. unit test conditions *v sd - - 1.2 v i s =1.7a,v gs =0v *t rr - 40 - ns i s =1.7a,v gs =0v, di/dt=100a/ s *pulse test : pulse width 300 s, duty cycle 2%
cystech electronics corp. spec. no. : c781g6 issued date : 2011.06.10 revised date : page no. : 3/6 MTN3434G6 cystek product specification characteristic curves
cystech electronics corp. spec. no. : c781g6 issued date : 2011.06.10 revised date : page no. : 4/6 MTN3434G6 cystek product specification characteristic curves(cont.)
cystech electronics corp. spec. no. : c781g6 issued date : 2011.06.10 revised date : page no. : 5/6 MTN3434G6 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c781g6 issued date : 2011.06.10 revised date : page no. : 6/6 MTN3434G6 cystek product specification tsop-6 dimension inches millimeters inches millimeters dim min. max. min. max. style: pin 1. drain (d) pin 2. drain (d) pin 3. gate (g) pin 4. source (s) pin 5. drain (d) pin 6. drain ( d ) date code device name 6-lead tsop-6 plastic surface mounted package cystek package code: g6 marking: 3434 dim min. max. min. max. a 0.1063 0.1220 2.70 3.10 g 0 0.0039 0 0.10 b 0.1024 0.1181 2.60 3.00 h - 0.0098 - 0.25 c 0.0551 0.0709 1.40 1.80 i 0.0047 ref 0.12 ref d 0.0748 ref 1.90 ref j 0.0177 ref 0.45 ref d1 0.0374 ref 0.95 ref k 0.0236 ref 0.60 ref d2 0.0374 ref 0.95 ref l 0 10 0 10 e 0.0118 0.0197 0.30 0.50 m - 0.0433 - 1.10 f 0.0276 0.0394 0.70 1.00 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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